Senior Thermal/Hardware Engineer - High-Power Networking Systems
Hewlett Packard Enterprise ยท ๐ Badung, Bali, Indonesia ยท Diposting 2026-10-09
FULL_TIMEโญ TERVERIFIKASI
IDR 800,000,000 - 1,200,000,000
Hewlett Packard Enterprise (HPE) is seeking a highly skilled Senior Thermal/Hardware Engineer to join our team in Badung, Bali. In this role, you will be responsible for designing, developing, and optimizing high-power networking systems, ensuring they meet the highest standards of performance and reliability. This is an exciting opportunity to work with cutting-edge technology and contribute to the development of next-generation networking solutions.๐ Tanggung Jawab Pekerjaan
Design and develop high-power networking systems, including routers, switches, and other network infrastructure components.,Conduct thermal analysis and optimization to ensure efficient heat dissipation and reliable operation of high-power systems.,Collaborate with cross-functional teams to integrate thermal solutions into overall system design.,Develop and implement test plans and procedures to validate the performance and reliability of high-power networking systems.,Troubleshoot and resolve technical issues related to thermal management and hardware performance.,Stay up-to-date with industry trends, technologies, and best practices in thermal engineering and hardware design.,Mentor and guide junior engineers and technicians in the team.,Contribute to the development of technical documentation and design specifications.๐ Kualifikasi & Syarat
Bachelor's degree in Electrical Engineering, Mechanical Engineering, or a related field.,Minimum of 8 years of experience in thermal engineering, hardware design, or a related field.,Strong understanding of thermal management principles and techniques.,Proficiency in using thermal simulation and analysis tools such as ANSYS, Flotherm, or similar.,Experience with high-power networking systems and components.,Familiarity with hardware design and development processes, including PCB layout, component selection, and assembly.,Excellent problem-solving and analytical skills.,Strong communication and collaboration skills, with the ability to work effectively in a team environment.๐ ๏ธ Keahlian
Thermal analysis and optimizationHigh-power system designPCB layout and hardware developmentThermal simulation tools (ANSYSFlotherm)Technical documentation and design specificationsMentoring and technical guidanceIndustry knowledge and best practices
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